Author: co-authored with the shapers

Reading time: 30 mins +

Abstract: This whitepaper jointly published by B&R Industrial Automation, Schneider Electric, ABB Automation Products, TTTech Computertechnik, General Electric Company, Huawei Technologies, Fraunhofer IOSB-INA, Phoenix Contact Electronics, Intel Corporation, Bosch Rexroth, Cisco Systems, Hirschmann Automation and Control, Moxa and Kalycito Infotech, concludes that OPC UA TSN is coming and it will substitute today’s Ethernet-based fieldbusses in a number of applications

The main reasons as outlined in the paper are:

  • Vendor independence
  • Broad adoption in other fields
  • Converged networks
  • Large and flexible topologies
  • Full IIoT capabilities
  • Unmatched performance
  • Integrated security and
  • Modern data modeling.

The relevant OPC UA standards and TSN standards for industrial use have already been implemented and tested in international test beds like the IIC by numerous international market players – with
amazing results. At present, the major chip makers are crafting their offers for connectivity in field devices in order to even match with the costs of today’s offerings soon. For single port devices standard Ethernet NICs can be used, hence there is no cost discussion anyway. For 2-port devices, marginal
HW costs are expected, as TSN will become an integral part of any competitive industrial SoC in the near future. Hence, OPC UA TSN will become a commodity – just like CAN used to be.

The PDF version of the whitepaper can be found here