Author: co-authored with the shapers Reading time: 30 mins +

Abstract: This whitepaper jointly published by B&R Industrial Automation, Schneider Electric, ABB Automation Products, TTTech Computertechnik, General Electric Company, Huawei Technologies, Fraunhofer IOSB-INA, Phoenix Contact Electronics, Intel Corporation, Bosch Rexroth, Cisco Systems, Hirschmann Automation and Control, Moxa and Kalycito Infotech, concludes that OPC UA TSN is coming and it will substitute today’s Ethernet-based fieldbusses in a number of applications The main reasons as outlined in the paper are:

  • Vendor independence
  • Broad adoption in other fields
  • Converged networks
  • Large and flexible topologies
  • Full IIoT capabilities
  • Unmatched performance
  • Integrated security and
  • Modern data modeling.

The relevant OPC UA standards and TSN standards for industrial use have already been implemented and tested in international test beds like the IIC by numerous international market players – with amazing results. At present, the major chip makers are crafting their offers for connectivity in field devices in order to even match with the costs of today’s offerings soon. For single port devices standard Ethernet NICs can be used, hence there is no cost discussion anyway. For 2-port devices, marginal HW costs are expected, as TSN will become an integral part of any competitive industrial SoC in the near future. Hence, OPC UA TSN will become a commodity – just like CAN used to be.

Whitepaper on OPC UA TSN by the Shaper group

The industrial communication market is dominated by Ethernet-based fieldbus systems. Although they share similar requirements and market segments, their implementations and ecosystems differ considerably. The majority of them have a corresponding umbrella organization that is guided and financed by one big market player who drives development of …